diff --git a/working-docs/cmu-updates/james-lin.md b/working-docs/cmu-updates/james-lin.md new file mode 100644 index 0000000..fe42f86 --- /dev/null +++ b/working-docs/cmu-updates/james-lin.md @@ -0,0 +1,35 @@ +--- +description: My name is James and I will be working on the ALD and IC Packaging this semester :3 +--- + +# James Lin + +**Weekly Update #1** + +* ALD: +I went through the primer and documentation to understand the basics of the project. I selected the delivery system as my main project for the semester. +Current struggle is going to be tracking down CAD that was previously done for the project. I plan to read more into the specific design requirements for the delivery system +and look through the CAD to understand what models of existing parts I will need to source/create. + + +* Packaging: +We started with a rough idea to build our own wirebonder, but after the meeting with Icey from the CMOS team, we decided that using the exisiting one +in the MEMs lab is sufficient for this semester. So instead I will be working more on a solution to package our silicon chips for this semester. +After talking to Joe, we decided to start by purchasing lead frames for testing and we are having trouble finding a complete DIP package that we can buy online. + +Link to DIP lead frame on ebay: https://www.ebay.com/itm/256227046773 + +Some notes from Friday's meeting with Icey: +* pads will be done with thermal evaporator - has AL capacity +* we should watch out for resistance at connection +* at MEMs lab pads are 200umx200um (larger is reccomended), need at least 300um-500um ish between each pad +* our chips are currently 1cmx1cm +* bond wires can extend to a few cm long + + +Going forward I will look into different options for packaging (pads on PCB or attempt to replicate DIP package from industry) +I will also start to explore manufacturing methods and some design requirements for our IC package. + + +**Weekly Update #2** +