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+---
+description: My name is James and I will be working on the ALD and IC Packaging this semester :3
+---
+
+# James Lin
+
+**Weekly Update #1**
+
+* ALD:  
+I went through the primer and documentation to understand the basics of the project. I selected the delivery system as my main project for the semester.
+Current struggle is going to be tracking down CAD that was previously done for the project. I plan to read more into the specific design requirements for the delivery system
+and look through the CAD to understand what models of existing parts I will need to source/create.
+
+
+* Packaging:  
+We started with a rough idea to build our own wirebonder, but after the meeting with Icey from the CMOS team, we decided that using the exisiting one
+in the MEMs lab is sufficient for this semester. So instead I will be working more on a solution to package our silicon chips for this semester.
+After talking to Joe, we decided to start by purchasing lead frames for testing and we are having trouble finding a complete DIP package that we can buy online.
+
+Link to DIP lead frame on ebay: https://www.ebay.com/itm/256227046773
+
+Some notes from Friday's meeting with Icey:  
+* pads will be done with thermal evaporator - has AL capacity
+* we should watch out for resistance at connection
+* at MEMs lab pads are 200umx200um (larger is reccomended), need at least 300um-500um ish between each pad
+* our chips are currently 1cmx1cm
+* bond wires can extend to a few cm long
+
+
+Going forward I will look into different options for packaging (pads on PCB or attempt to replicate DIP package from industry)
+I will also start to explore manufacturing methods and some design requirements for our IC package.
+
+
+**Weekly Update #2**  
+<img src="https://github.com/user-attachments/assets/26eefb33-a548-458a-a06d-ece74635d2d8" width="200" height="200" />